Authors: A.A. Kleptsov, L.N. Kleptsova
Title of the article: Method of parametric optimization of technological processes in providing characteristics of the surface layer of parts
Year: 2020, Issue: 4, Pages: 9-17
Branch of knowledge: 05.02.08 Engineering Technology
Index UDK: 621.91.01
DOI: 10.26730/1999-4125-2020-4-9-17
Abstract: In machining parts, the main attention is usually paid to achieving accuracy, while other quality indicators, such as characteristics of the surface layer of the parts that determine their wear resistance and reliability, are ignored. To obtain the details that best meet their official appointment, it is necessary to strive not only to achieve a specified accuracy, but also to ensure a certain quality of the surface layer.
In the manufacture of any part, there are several variants of technological process that provide the required accuracy and quality of the surface layer. In this regard, an actual task of engineering technology is the optimization of technological processes at all stages of their development, and, in particular, parametric optimization.
The article proposes a methodology for optimizing the technological processes of mechanical processing of parts that allows you to designate the optimal cost modes for processing parts that provide the specified accuracy of processing parts, roughness and physico-mechanical characteristics of the quality of their surfaces. The use of technological cost as a criterion of optimization is substantiated.
To implement the methodology, an algorithm and software have been developed that reduce the design time of technological processes and the cost of processing parts and increase the objectivity of technical regulation.
A variant of the use of the proposed methodology for the rationing of the technological process of a part of the "body of revolution" type is given.
Key words: technological process optimization accuracy roughness cost criteria limitations processing mode
Receiving date: 12.08.2020
Publication date: 30.10.2020
This work is licensed under a Creative Commons Attribution 4.0 License.